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NCP571, NCV571 150 mA CMOS Low Iq Low Output Voltage Regulator
The NCP571 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP571 series features an ultra-low quiescent current of 4.0 mA. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP571 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 mF. The device is housed in the TSOP-5 or DFN6 surface mount package. Standard voltage versions are 0.8 V, 0.9 V, 1.0 V and 1.2 V.
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6 5 1 TSOP-5 SN SUFFIX CASE 483 1 DFN6 MN SUFFIX CASE 506BA
* * * * * * *
Low Quiescent Current of 4.0 mA Typical Maximum Operating Voltage of 12 V Low Output Voltage Option down to 0.8 V High Accuracy Output Voltage of 3.0% Industrial Temperature Range of -40C to +85C (NCV571, TA = -40C to +125C) NCV Prefix for Automotive and Other Applications Requiring Site and Change Controls These are Pb-Free Devices
MARKING DIAGRAMS
XXXAYWG G
1
XX MG G
Typical Applications
* Battery Powered Instruments * Hand-Held Instruments * Camcorders and Cameras
Vin 1 Thermal Shutdown Enable ON OFF Driver w/ Current Limit + 3 5 Vout
XXX A Y W M G
= Specific Device Code = Assembly Location = Year = Work Week = Date Code = Pb-Free Package
(Note: Microdot may be in either location)
See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
GND
2
Figure 1. Representative Block Diagram
(c) Semiconductor Components Industries, LLC, 2010
May, 2010 - Rev. 3
1
Publication Order Number: NCP571/D
NCP571, NCV571
PIN CONNECTIONS TSOP-5 package
Vin GND Enable 1 2 3 (Top View) 4 NC 5 Vout
DFN6 package
Vout 1 NC 2 GND 3 (Top View) EP 6 Vin 5 NC 4 Enable
PIN FUNCTION DESCRIPTION
DFN6 1 2 3 4 TSOP-5 5 4 2 3 Pin Name Vout NC GND Enable Regulated output voltage. No Internal Connection. It is recommended to connect this pin to GND potential. Power supply ground. This input is used to place the device into low-power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable pin should be connected to Vin. No Internal Connection. It is recommended to connect this pin to GND potential. Positive power supply input voltage. No Internal Connection. It is recommended to connect this pin to GND potential. Description
5 6 EP
- 1 -
NC Vin EP
MAXIMUM RATINGS
Rating Input Voltage Enable Voltage Output Voltage Power Dissipation Operating Junction Temperature Operating Ambient Temperature Storage Temperature ESD Capability, Human Body Model (Note 1) ESD Capability, Machine Mode (Note 1) ESD Capability, Charged Device Model (Note 1) NCP571 NCV571 Symbol Vin VEN Vout PD TJ TA Tstg ESDHBM ESDMM ESDCDM Value 0 to 12 -0.3 to Vin + 0.3 -0.3 to Vin + 0.3 Internally Limited +150 -40 to +85 -40 to +125 -55 to +150 2000 200 1000 Unit V V V W C C C V V V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard) 2. Latchup capability (85C) $100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating Junction-to-Ambient PSIJ-Lead 2 Junction-to-Ambient PSIJ-Lead 2 NOTE: TSOP-5 TSOP-5 DFN6 DFN6 Symbol RqJA YJ-L2 RqJA YJ-L2 Test Conditions 1 oz Copper Thickness, 100 mm2 1 oz Copper Thickness, 100 mm2 1 oz Copper Thickness, 100 1 oz Copper Thickness, 100 mm2 mm2 Typical Value 250 68 190 84 Unit C/W C/W C/W C/W
Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51-1, 2, 3, 7, 12.
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NCP571, NCV571
Vin 1 Vin Vout 5 4 3 C2 0.1 mF GND Vout
NC 2 C1 0.1 mF GND GND EN
Enable
Figure 2. Typical Application Schematic for TSOP-5 Package
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NCP571, NCV571
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25C, unless otherwise
noted) Characteristic Output Voltage (TA = 25C, Iout = 10 mA) 0.8 V 0.9 V 1.0 V 1.2 V Output Voltage (TA = -40C to +85C for NCP571 or TA = -40C to +125C for NCV571, Iout = 10 mA) (Note 5) 0.8 V 0.9 V 1.0 V 1.2 V Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA) Load Regulation (Iout = 10 mA to 150 mA, Vin = Vout + 2.0 V) Output Current (Vout = (Vout at Iout = 100 mA) - 3%) 0.8 V (Vin = 3.0 V) 0.9 V (Vin = 3.0 V) 1.0 V (Vin = 3.0 V) 1.2 V (Vin = 3.0 V) Dropout Voltage (Iout = 10 mA, Measured at Vout - 3.0%) 0.8 V 0.9 V 1.0 V 1.2 V Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to 150 mA) Output Voltage Temperature Coefficient Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Output Short Circuit Current (Vout = 0 V) (Note 4) 0.8 V (Vin = 3.0 V) 0.9 V (Vin = 3.0 V) 1.0 V (Vin = 3.0 V) 1.2 V (Vin = 3.0 V) 3. Maximum package power dissipation limits must be observed. Symbol Vout Min - 3% 0.776 0.873 0.970 1.164 - 4% 0.768 0.864 0.960 1.152 Regline Regload Io(nom) - - 150 150 150 150 - - - - - - - 1.3 - 160 160 160 160 0.8 0.9 1.0 1.2 10 40 - - - - 730 650 550 350 0.1 4.0 100 - - 260 260 260 260 Typ 0.8 0.9 1.0 1.2 Max + 3% 0.824 0.927 1.030 1.236 + 4% 0.832 0.936 1.040 1.248 30 65 - - - - 850 750 650 450 1.0 8.0 - - 0.3 600 600 600 600 mV mV mA Unit V
Vout
V
Vin-Vout
mV
IQ
uA
Tc Vth(en)
ppm/C V
Iout(max)
mA
PD +
T J(max) * T A R qJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. NCP571 Tlow = -40C Thigh = +85C NCV571 Tlow = -40C Thigh = +125C.
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NCP571, NCV571
3.2 3.0 2.8 2.6 2.4 2.2 0.00 Vin = 6 V 3.2 3.0 2.8 Vin = 6 V 2.6 Vin = 3 V 2.4 2.2 0.00 TA = 25C Vout = 1.2 V 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 OUTPUT CURRENT (A)
GROUND CURRENT (mA)
Vin = 3 V
TA = 25C Vout = 0.8 V 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16
OUTPUT CURRENT (A)
Figure 3. Ground Pin Current vs. Output Current
3.5 3.5
GROUND CURRENT (mA)
Figure 4. Ground Pin Current vs. Output Current
GROUND CURRENT (mA)
3.0
Vin = 6 V
GROUND CURRENT (mA)
3.0
2.5
Vin = 3 V
2.5
Vin = 6 V Vin = 3 V
2.0 Vout = 0.8 V Iout = 30 mA 1.5 -40 -20 0 20 40 60 80 100
2.0 Vout = 1.2 V Iout = 30 mA -20 0 20 40 60 80 100 AMBIENT TEMPERATURE (C)
1.5 -40
AMBIENT TEMPERATURE (C)
Figure 5. Ground Pin Current vs. Temperature
3.5 3 GROUND CURRENT (mA) 2.5 2 1.5 1 0.5 0 0 2 4 6 8 TA = 25C Vout = 0.8 V Iout = 30 mA 10 12 INPUT VOLTAGE (V) GROUND CURRENT (mA) 3 2.5 2 1.5 1 0.5 0
Figure 6. Ground Pin Current vs. Temperature
TA = 25C Vout = 1.2 V Iout = 30 mA 0 2 4 6 8 10 12 INPUT VOLTAGE (V)
Figure 7. Ground Pin Current vs. Input Voltage
Figure 8. Ground Pin Current vs. Input Voltage
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NCP571, NCV571
1.0 0.8 0.6 0.4 0.2 0.0 TA = 25C OUTPUT VOLTAGE (V) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 10 12 0.0 0 2 4 6 8 INPUT VOLTAGE (V) 10 12 Iout = 70 mA Iout = 10 mA TA = 25C
OUTPUT VOLTAGE (V)
Iout = 70 mA Iout = 10 mA Iout = 150 mA
Iout = 150 mA
0
2
4 6 8 INPUT VOLTAGE (V)
Figure 9. Output Voltage vs. Input Voltage
Figure 10. Output Voltage vs. Input Voltage
Figure 11. Line Transient Response
Figure 12. Line Transient Response
3 V to 4 V
Figure 13. Line Transient Response
Figure 14. Line Transient Response
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NCP571, NCV571
Figure 15. Load Transient Response
Figure 16. Load Transient Response
VENA
VENA: 1 V/div
VENA
VENA: 1 V/div
Figure 17. Enable Operation
Figure 18. Enable Operation
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NCP571, NCV571
APPLICATIONS INFORMATION A typical application circuit for the NCP571 series is shown in Figure 2.
Input Decoupling (C1)
without fear of instabilities. Larger values improve noise rejection and load regulation transient response.
Enable Operation
A 0.1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP571 package. Higher values and lower ESR will improve the overall line transient response.
Output Decoupling (C2)
The NCP571 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 3.0 W can thus safely be used. The minimum decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger output capacitors can be used
The enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. It is not recommended to leave this pin on air. In case the voltage of Enable signal is higher then Input voltage of NCP571 device it is necessary add an resistor divider in order to keep voltage at Enable pin bellow Input voltage. A single gate device of VHC family could be used for this logic level translation. The NL17SZ06 device could be chosen for non inverting open-drain buffer as shown in Figure 19. Other possibility is using NL17SZ16 device as shown in Figure 20. More information is mentioned in Application Note AND8101/D.
NCP571 Vin Vin Vout NC C1 0.1 mF GND Enable C2 0.1 mF Vout
GND
GND
3.3 V 3.3 V 0V Enable NL17SZ06
Figure 19.
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NCP571, NCV571
2.7 V NCP571 Vin Vout NC C1 0.1 mF GND Enable C2 0.1 mF Vout
Vin
GND
GND
3.3 V 0V Enable 0V
2.7 V
NL17SZ16
Figure 20. Hints
Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible.
Thermal
conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by:
PD + T J(max) * T A R qJA
As power across the NCP571 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP571 has good thermal
If junction temperature is not allowed above the maximum 125C, then the NCP571 can dissipate up to 400 mW @ 25C. The power dissipated by the NCP571 can be calculated from the following equation:
P tot + V in(max) I GND ) I out * V out * I out
If a 150 mA output current is needed then the ground current from the data sheet is 4.0 mA.
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NCP571, NCV571
ORDERING INFORMATION
Device NCP571SN08T1G NCP571SN09T1G NCP571SN10T1G NCP571SN12T1G NCV571SN08T1G NCV571SN09T1G NCV571SN10T1G NCV571SN12T1G NCP571MN08TBG NCP571MN09TBG NCP571MN10TBG NCP571MN12TBG NCV571MN08TBG NCV571MN09TBG NCV571MN10TBG NCV571MN12TBG Nominal Output Voltage 0.8 0.9 1.0 1.2 0.8 0.9 1.0 1.2 0.8 0.9 1.0 1.2 0.8 0.9 1.0 1.2 Marking N6A N6E N6C N6D N6F N6G N6H N6J AC AD AE AA AF AG AH AJ Package TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) TSOP-5 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) DFN6 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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NCP571, NCV571
PACKAGE DIMENSIONS
TSOP-5 (SOT23-5, SC59-5) SN SUFFIX CASE 483-02 ISSUE H
NOTE 5 2X
D 5X 0.20 C A B M
0.10 T 0.20 T L A
5 1 2 4 3
2X
B
S K
DETAIL Z
G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00
DETAIL Z
C 0.05 H T
SEATING PLANE
J
SOLDERING FOOTPRINT*
0.95 0.037 1.9 0.074
2.4 0.094 1.0 0.039 0.7 0.028
mm inches
SCALE 10:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP571, NCV571
PACKAGE DIMENSIONS
DFN6, 2x2.2, 0.65P CASE 506BA-01 ISSUE A
D A B L1 E DETAIL A
ALTERNATE TERMINAL CONSTRUCTIONS
L
L
PIN ONE REFERENCE 2X
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 0.30 2.00 BSC 1.10 1.30 2.20 BSC 0.70 0.90 0.65 BSC 0.20 --- 0.25 0.35 0.00 0.10
0.10 C
2X
0.10 C A 0.10 C
7X DETAIL B
A1
DETAIL B
ALTERNATE CONSTRUCTIONS
0.08 C
SIDE VIEW A1 D2 e
1 3 6X
C
SEATING PLANE
PACKAGE OUTLINE
DETAIL A 6X
L
L1 0.96 2.50
E2
1
K
6
4
6X
b 0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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CC CC EE
0.35
6X
EE EE
EEE EEE
TOP VIEW
EXPOSED Cu
MOLD CMPD
A3
SOLDERING FOOTPRINT*
1.36 0.58
6X
0.65 PITCH
DIMENSIONS: MILLIMETERS
NCP571/D

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